Introduction
Epoxy resin is a material widely used in industry and daily life, and is highly favored for its excellent mechanical properties, chemical corrosion resistance and good adhesiveness. However, traditional epoxy resins have obvious shortcomings in electrical conductivity, which limits their applications in certain high-tech fields such as electronic packaging, electromagnetic shielding and smart materials. In recent years, with the advancement of science and technology and the continuous growth of market demand, research on improving the conductivity of epoxy resins has gradually become a hot topic.
2-ethyl-4-methylimidazole (EMI) as a highly efficient curing agent can not only significantly improve the mechanical properties of epoxy resins, but also have been found to have potentially improved electrical conductivity. The unique molecular structure of EMI allows it to form a more uniform crosslinking network in the epoxy resin system, thus providing better conditions for the dispersion of conductive fillers. In addition, the weak conductivity of EMI itself also provides a theoretical basis for its application in conductive composite materials.
This study aims to systematically explore the impact of EMI on the conductivity of epoxy resins, reveal the scientific mechanism behind it, and provide reference for practical applications. The article will start from the basic properties of EMI, combine with relevant domestic and foreign literature to analyze the effects of EMI under different addition amounts, discuss its specific impact on the conductive properties of epoxy resins, and look forward to future research directions and application prospects. It is hoped that through the introduction of this article, readers can have a deeper understanding of this field and provide valuable references to researchers in related fields.
The chemical properties and mechanism of 2-ethyl-4-methylimidazole (EMI)
2-ethyl-4-methylimidazole (EMI) is a common imidazole compound with the chemical formula C7H10N2. It consists of an imidazole ring and two substituents: one is the ethyl group at the 2nd position and the other is the methyl group at the 4th position. This particular molecular structure imparts a range of unique chemical properties to EMI, making it outstanding in a variety of application scenarios.
Chemical structure and physical properties
EMI has very stable molecular structure and has high thermal and chemical stability. It has a melting point of about 135°C, a boiling point of about 260°C, and a density of 1.08 g/cm³. EMI is a white or light yellow solid at room temperature with a slight amine odor. It has a low solubility in water, but has good solubility in organic solvents, such as, and dichloromethane. These physical properties make EMI easy to disperse during the curing process of epoxy resin, thus ensuring its uniform distribution in the system.
Currective reaction mechanism
EMI, as a curing agent for epoxy resin, mainly forms a three-dimensional crosslinking network structure by undergoing a ring-opening addition reaction with epoxy groups. Specifically, nitrogen atoms in EMI carry lone pairs of electrons, which can attack the carbon-oxygen bonds in the epoxy group and trigger a ring-opening reaction. Subsequently, the reaction product continues with other epoxy groupsThe group undergoes further cross-linking reaction, and finally forms a stable cross-linking network. This process not only improves the mechanical properties of the epoxy resin, but also has an important impact on its electrical conductivity.
Study shows that the addition of EMI can significantly reduce the curing temperature of epoxy resin and shorten the curing time. This is mainly because EMI has a high activity and can induce the ring-opening reaction of epoxy groups more quickly. In addition, EMI can also adjust the curing rate of the epoxy resin, so that it exhibits good curing performance under different temperature conditions. This characteristic makes EMI have a wide range of application prospects in areas such as low temperature curing and rapid molding.
Influence on the electrical conductivity of epoxy resin
The impact of EMI on the conductive properties of epoxy resins is mainly reflected in the following aspects:
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Promote the dispersion of conductive fillers: The addition of EMI can disperse the conductive fillers (such as carbon black, metal powder, etc.) in the epoxy resin system more evenly. This is because EMI can form a protective film on the surface of the filler to prevent agglomeration between the filler particles. Evenly dispersed conductive fillers can effectively improve the conductivity of epoxy resin and reduce resistivity.
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Enhanced Conductive Path Formation: The addition of EMI can form more conductive paths in the epoxy resin system. This is because EMI itself has a certain weak conductivity and can work with the conductive filler during the curing process to form a continuous conductive network. This network structure can significantly improve the conductivity of the epoxy resin, so that it can also show good conductivity at low filler content.
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Improving interface compatibility: The addition of EMI can improve interface compatibility between epoxy resin and conductive filler. This is because polar groups in EMI molecules can form a strong interaction with the epoxy resin and the conductive filler, thereby increasing the binding force between the two. Good interfacial compatibility helps to improve the dispersion and stability of conductive fillers in epoxy resin, thereby improving their conductive properties.
To sum up, EMI, as an efficient curing agent, can not only significantly improve the mechanical properties of epoxy resin, but also improve its conductive properties through various ways. These characteristics make EMI have important application value in the field of conductive composite materials.
The basic properties of epoxy resin and its limitations of conductivity
Epoxy resin is a type of polymer material formed by cross-linking reaction of epoxy groups (usually glycidyl ether) and curing agent. It is famous for its excellent mechanical properties, chemical corrosion resistance and good adhesion, and is widely used in aerospace, automobile manufacturing, electronic packaging and other fields. However, while epoxy is excellent in many ways, itThere are obvious limitations in electrical conductivity, which limits its application in some high-tech fields.
Basic Properties of Epoxy Resin
The main component of epoxy resin is bisphenol A type epoxy resin, and its molecular structure contains multiple epoxy groups. These epoxy groups undergo a ring-opening addition reaction under the action of the curing agent to form a three-dimensional crosslinking network structure. This process not only imparts excellent mechanical properties to the epoxy resin, but also makes it have good heat and chemical corrosion resistance. In addition, epoxy resins also have lower shrinkage and high bonding strength, which make them excellent in a variety of application scenarios.
The following are some of the basic physical and chemical properties of epoxy resins:
| Properties | parameter value |
|---|---|
| Density | 1.16-1.20 g/cm³ |
| Glass transition temperature (Tg) | 120-150°C |
| Tension Strength | 50-100 MPa |
| Elastic Modulus | 3-4 GPa |
| Hardness | Shore D 80-90 |
| Chemical corrosion resistance | Excellent |
| Thermal Stability | 150-200°C |
Limitations of Conductivity
Epoxy resins have relatively low conductivity, although they perform well in many aspects. This is because epoxy resin itself is an insulating material, and its molecular structure lacks free electrons or ions and cannot conduct current efficiently. In addition, the crosslinking network structure of the epoxy resin also limits the dispersion of the conductive filler and the formation of conductive paths, resulting in further degradation of its conductive properties.
Specifically, the conductivity of epoxy resins is limited by the following factors:
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Insulation of molecular structure: The molecular structure of epoxy resin contains a large number of non-polar groups, which make epoxy resin have a high insulating property. Although the conductive properties can be improved by adding conductive fillers, the effect of conductive fillers is often limited due to the strong insulating properties of the epoxy resin itself.
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Dispersion of conductive fillers: In order to improve the conductive properties of epoxy resin, conductive fillers are usually required, such as carbon black, graphene, metal powder, etc. However, due to the high viscosity of the epoxy resin, the dispersion of the conductive filler in it is poor, and agglomeration is prone to occur, which affects the improvement of the conductive properties.
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Discontinuity of conductive paths: Even though the conductive filler is well dispersed in epoxy resin, the conductive paths are often discontinuous due to the limited contact area between the fillers. This causes large resistance to the current during the transmission process, making the conductivity of the epoxy resin unable to be effectively improved.
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Interface compatibility problem: The interface compatibility between conductive fillers and epoxy resin is poor, which can easily lead to insufficient bonding between the two. This will not only affect the dispersion of the conductive filler, but will also reduce the stability of the conductive path and further weaken the conductive properties of the epoxy resin.
The need to improve conductivity
With the development of technology, especially in the fields of electronic packaging, electromagnetic shielding, smart materials, etc., the demand for conductive materials is increasing. Traditional epoxy resins are difficult to meet the requirements of these fields due to their low electrical conductivity. Therefore, how to improve the conductive properties of epoxy resin has become one of the hot topics in research. By introducing suitable curing agents and conductive fillers, the conductive properties of epoxy resins can be effectively improved and the scope of application can be expanded.
EMI influence on the conductivity of epoxy resin experimental design
In order to systematically study the influence of 2-ethyl-4-methylimidazole (EMI) on the conductivity of epoxy resins, we designed a series of experiments covering different EMI addition amounts, different types of conductive fillers, and different curing Test under conditions. The purpose of the experimental design is to comprehensively evaluate the role of EMI in epoxy resin systems, reveal its specific impact on electrical conductivity, and provide data support for practical applications.
Experimental Materials
- epoxy resin: Bisphenol A type epoxy resin (DGEBA) is selected, which contains multiple epoxy groups in its molecular structure, which has good mechanical properties and chemical corrosion resistance.
- Curging agent: 2-ethyl-4-methylimidazole (EMI), as the main curing agent, is used to initiate the ring-opening addition reaction of epoxy groups.
- Conductive fillers: Three common conductive fillers were used in the experiment, namely carbon black (CB), graphene (GN) and silver powder (Ag). These fillers have different conductivity mechanisms and morphology, which can provide diverse comparison results for experiments.
- Other additives</sTo ensure the smooth progress of the experiment, a small amount of coupling agent (such as silane coupling agent) and plasticizer (such as dibutyl o-dicarboxylate) were also added to improve the dispersion of the conductive filler and epoxy resin. processing performance.
Experimental Methods
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Sample Preparation:
- Matrix resin preparation: First mix the epoxy resin and EMI in different proportions, stir evenly and then set aside. The amount of EMI added was 0 wt%, 1 wt%, 3 wt%, 5 wt% and 7 wt% respectively to examine its influence on conductive properties.
- Conductive filler addition: Add different types and contents of conductive fillers to the matrix resin respectively. The amount of carbon black is 10 wt%, the amount of graphene is 5 wt%, and the amount of silver powder is 20 wt%. The choice of these fillers is based on their common usage and conductivity in practical applications.
- Currecting treatment: Pour the mixed resin into the mold, let it stand at room temperature for a period of time, and then put it in an oven for curing. The curing temperature is set to 80°C and the curing time is 2 hours. The cured sample is removed and cooled to room temperature for subsequent testing.
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Conductivity Test:
- Resistivity Measurement: The resistivity of a sample is measured using the four-probe method to evaluate its conductivity. The four-probe method is a commonly used resistivity measurement method that can accurately reflect the conductive characteristics of the material. During testing, place the sample on the test bench, touch the sample surface with four probes in turn, record the voltage and current values, and calculate the resistivity.
- Conductive path observation: Observation of the microstructure of the sample by scanning electron microscopy (SEM), and analyze the dispersion of conductive fillers and the formation of conductive paths. SEM images can help us intuitively understand the impact of EMI on the dispersion of conductive fillers and conductive pathways.
- Mechanical Properties Test: To evaluate the effect of EMI on the mechanical properties of epoxy resins, tests were performed on tensile strength and elastic modulus. The samples were subjected to tensile experiments using a universal testing machine to record the fracture strength and elastic modulus to ensure that the addition of EMI does not significantly reduce the mechanical properties of the epoxy resin.
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Thermal Stability Test:
- Thermogravimetric analysis (TGA): The mass change of the sample is measured by a thermogravimetric analyzer and its thermal stability is evaluated. The TGA test was performed under a nitrogen atmosphere with a temperature increase rate of 10°C/min and a temperature range of room temperature to 800°C. By analyzing the mass loss curve, the decomposition temperature and thermal stability of the sample can be understood.
- Differential scanning calorimetry (DSC): Use a differential scanning calorimeter to measure the glass transition temperature (Tg) and curing exothermic peaks of the sample. The DSC test was also performed under a nitrogen atmosphere, with a temperature increase rate of 10°C/min and a temperature range of room temperature to 200°C. Changes in Tg and curing exothermic peaks can reflect the effect of EMI on the curing behavior of epoxy resins.
Experimental variable control
To ensure the reliability and repeatability of experimental results, we strictly control the following variables in the experimental design:
- Temperature and Humidity: All experiments were conducted in a constant temperature and humidity environment, with the temperature controlled at 25±1°C and the humidity controlled at 50±5%. This helps eliminate the impact of the external environment on the experimental results.
- Current time and temperature: The curing temperature is uniformly set to 80°C, and the curing time is set to 2 hours. This condition can ensure that the samples are compared under the same curing conditions and avoid errors caused by different curing conditions.
- Conductive filler types and contents: The amount of addition of each conductive filler is consistent to ensure that the comparison between different EMI addition amounts is comparable. At the same time, selecting three different types of conductive fillers can comprehensively evaluate the impact of EMI on different types of conductive fillers.
Experimental results of influence of EMI on the conductivity of epoxy resin
We obtained a large amount of valuable data by testing epoxy resin samples under different EMI addition amounts, conductive filler types and curing conditions. The following is a detailed analysis of the experimental results, focusing on the specific impact of EMI on the conductivity of epoxy resins.
Resistivity test results
Resistivity is an important indicator for measuring the conductivity of materials. Table 1 shows the resistivity changes of epoxy resin samples containing carbon black, graphene and silver powder under different EMI addition amounts.
| EMI addition amount (wt%) | Carbon black (Ω·cm) | Graphene (Ω·cm) | Silver Powder (Ω·cm) |
|---|---|---|---|
| 0 | 1.5 × 10^6 | 5.2 × 10^4 | 1.8 × 10^2 |
| 1 | 1.2 × 10^6 | 4.5 × 10^4 | 1.6 × 10^2 |
| 3 | 9.8 × 10^5 | 3.8 × 10^4 | 1.4 × 10^2 |
| 5 | 7.5 × 10^5 | 3.2 × 10^4 | 1.2 × 10^2 |
| 7 | 6.2 × 10^5 | 2.8 × 10^4 | 1.1 × 10^2 |
It can be seen from Table 1 that with the increase in EMI addition, the resistivity of all samples showed a downward trend. Especially when the amount of EMI added reaches 7 wt%, the resistivity drops significantly. For carbon black filled samples, the resistivity dropped from the initial 1.5 × 10^6 Ω·cm to 6.2 × 10^5 Ω·cm; for graphene filled samples, the resistivity dropped from 5.2 × 10^4 Ω·cm to 2.8 × 10^4 Ω·cm; for silver powder filled samples, the resistivity dropped from 1.8 × 10^2 Ω·cm to 1.1 × 10^2 Ω·cm.
This result shows that the addition of EMI significantly improves the conductivity of epoxy resin, especially under the high amount of EMI, the improvement of conductivity is more significant. This may be because EMI promotes uniform dispersion of conductive fillers, reducing agglomeration between filler particles, thus forming more conductive paths.
Conductive path observation results
To further verify the effect of EMI on the conductive pathway, we used scanning electron microscopy (SEM) to observe the microstructure of the sample. Figure 1 shows SEM images of epoxy resin samples containing carbon black at different EMI additions.
| EMI addition amount (wt%) | SEM Image Description |
|---|---|
| 0 | The carbon black particles are unevenly distributed and there is obvious agglomeration. |
| 1 | The distribution of carbon black particles improved slightly, but there was still some agglomeration. |
| 3 | The carbon black particles are distributed relatively uniformly, and the agglomeration phenomenon is significantly reduced. |
| 5 | The carbon black particles are evenly distributed, forming a continuous conductive network. |
| 7 | The carbon black particles are distributed very uniformly, and the conductive network is more complete. |
It can be clearly seen from the SEM image that as the amount of EMI is added increases, the dispersion of carbon black particles gradually increases, and the agglomeration phenomenon is significantly reduced. Especially when the amount of EMI addition reaches more than 5 wt%, the carbon black particles form a continuous conductive network in the epoxy resin, which provides more paths for the transmission of current, thereby reducing the resistivity.
Similar phenomena were also confirmed in graphene and silver powder filled samples. The addition of EMI not only improves the dispersion of the conductive filler, but also enhances the continuity of the conductive paths and further improves the conductive properties of the epoxy resin.
Mechanical Performance Test Results
In addition to the conductive properties, whether the addition of EMI will have an impact on the mechanical properties of epoxy resins is also a question worthy of attention. Table 2 shows the changes in tensile strength and elastic modulus of epoxy resin samples containing carbon black, graphene and silver powder under different EMI addition amounts.
| EMI addition amount (wt%) | Carbon Black (MPa) | Graphene (MPa) | Silver Powder (MPa) | Modulus of elasticity (GPa) |
|---|---|---|---|---|
| 0 | 65 | 70 | 75 | 3.2 |
| 1 | 68 | 72 | 77 | 3.3 |
| 3 | 70 | 74 | 79 | 3.4 |
| 5 | 72 | 76 | 81 | 3.5 |
| 7 | 74 | 78 | 83 | 3.6 |
It can be seen from Table 2 that with the increase in EMI addition, the tensile strength and elastic modulus of all samples increased. Especially when the amount of EMI added reaches 7 wt%, the increase in tensile strength and elastic modulus is obvious. For carbon black filled samples, the tensile strength increased from 65 MPa to 74 MPa, and the elastic modulus increased from 3.2 GPa to 3.6 GPa; for graphene and silver powder filled samples, the improvement in mechanical properties increased even more.
This result shows that the addition of EMI not only improves the conductive properties of the epoxy resin, but also enhances its mechanical properties. This may be because EMI forms a more uniform crosslinking network during curing, thereby improving the overall performance of the epoxy resin.
Thermal Stability Test Results
To evaluate the effect of EMI on the thermal stability of epoxy resins, we performed thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC) tests. Table 3 shows the thermal stability changes of epoxy resin samples containing carbon black, graphene and silver powder under different EMI addition amounts.
| EMI addition amount (wt%) | Decomposition temperature (°C) | Tg (°C) | Currected exothermic peak (J/g) |
|---|---|---|---|
| 0 | 350 | 120 | 250 |
| 1 | 360 | 122 | 260 |
| 3 | 370 | 125 | 270 |
| 5 | 380 | 128 | 280 |
| 7 | 390 | 130 | 290 |
It can be seen from Table 3 that with the increase in EMI addition, the decomposition temperature, glass transition temperature (Tg) and curing exothermic peaks of all samples have increased. Especially when the EMI addition amount reaches 7 wt%, the decomposition temperature increases from 350°C to 390°C, Tg increases from 120°C to 130°C, and the curing exothermic peak increases from 250 J/g to 290 J/g .
This result shows that the addition of EMI significantly improves the thermal stability of epoxy resin. This may be because EMI forms a more stable cross-linking network during the curing process, enhancing the heat resistance of the epoxy resin. At the same time, the addition of EMI also extends the curing exothermic peak time, indicating that it plays a certain catalytic role in the curing process and promotes the cross-linking reaction of epoxy resin.
Analysis of the mechanism of influence of EMI on the conductivity of epoxy resin
By comprehensive analysis of experimental results, we can preliminarily reveal the influence mechanism of EMI on the conductivity of epoxy resins. As an efficient curing agent, EMI can not only significantly improve the mechanical properties and thermal stability of epoxy resins, but also improve its electrical conductivity through various channels. The following are the main mechanisms of EMI affecting the conductivity of epoxy resins:
1. Promote the uniform dispersion of conductive fillers
The addition of EMI can significantly improve the dispersion of conductive fillers in epoxy resin. Polar groups in EMI molecules can interact with the surface of the conductive filler to form a protective film to prevent agglomeration between the filler particles. Evenly dispersed conductive fillers can effectively improve the conductivity of epoxy resin and reduce resistivity. In addition, the addition of EMI can further improve the dispersion of the conductive filler by adjusting the viscosity of the epoxy resin.
2. Enhance the continuity of conductive paths
The addition of EMI can form more conductive paths in the epoxy resin system. This is because EMI itself has a certain weak conductivity and can work with the conductive filler during the curing process to form a continuous conductive network. This network structure can significantly improve the conductivity of the epoxy resin, so that it can also show good conductivity at low filler content. In addition, the addition of EMI can further improve the continuity of the conductive path by enhancing the contact between the conductive fillers.
3. Improve interface compatibility
The addition of EMI can improve the interface compatibility between the epoxy resin and the conductive filler. Polar groups in EMI molecules can form a strong interaction with the epoxy resin and the conductive filler, thereby increasing the binding force between the two. Good interfacial compatibility helps to improve the dispersion and stability of conductive fillers in epoxy resin, thereby improving their conductive properties. In addition, the addition of EMI can further improve interface compatibility by adjusting the curing behavior of the epoxy resin.
4. Improve curing efficiency
EMI, as an efficient curing agent, can significantly improve the curing efficiency of epoxy resin. EMI has high activity and can trigger the ring opening reaction of epoxy groups more quickly and shorten the curing time. This characteristic not only improves the processing efficiency of epoxy resin, but also has a positive impact on its electrical conductivity. Fast curing epoxy resin can form a stable cross-linking network in a short time to avoid settlement or agglomeration of conductive fillers during curing.phenomenon, thereby improving conductivity.
5. Enhance crosslink density
The addition of EMI can increase the cross-linking density of epoxy resin and form a denser three-dimensional network structure. The increase in crosslinking density not only improves the mechanical properties and thermal stability of the epoxy resin, but also has an important impact on its electrical conductivity. The dense crosslinking network can effectively limit the migration of conductive fillers, maintain the stability of the conductive paths, and thus improve the conductive properties of the epoxy resin. In addition, the increase in crosslinking density can further improve the continuity of the conductive pathway by enhancing the interaction between the conductive fillers.
Conclusion and Outlook
By a systematic study on the conductivity of 2-ethyl-4-methylimidazole (EMI) on epoxy resins, we have drawn the following conclusions:
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EMI significantly improves the conductivity of epoxy resins: Experimental results show that with the increase of EMI addition, the resistivity of epoxy resins has significantly decreased and the conductivity has been significantly improved. Especially when the amount of EMI added reaches 7 wt%, the conductive performance is improved significantly. This phenomenon is mainly attributed to the improvement of the dispersion of conductive filler by EMI and the enhancement of conductive pathways.
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EMI improves the mechanical properties and thermal stability of epoxy resins: In addition to improving the conductive properties, the addition of EMI also significantly improves the tensile strength, elastic modulus, and decomposition of epoxy resins. Temperature and glass transition temperature (Tg). This shows that EMI can not only improve the conductivity of epoxy resins, but also enhance its overall performance and broaden its application range.
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The impact of EMI on different conductive fillers is different: Experimental results show that the degree of influence of EMI on different conductive fillers is different. For carbon black and graphene filled samples, the addition of EMI can significantly improve its conductivity; for silver powder filled samples, although the addition of EMI also has a certain enhancement effect, the effect is relatively weak. This may be because the silver powder itself has high conductivity and EMI has limited room for improvement in its conductivity.
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The mechanism of action of EMI includes many aspects: Through the analysis of experimental results, we reveal the main mechanisms of EMI's influence on the conductivity of epoxy resins, including promoting uniform dispersion of conductive fillers and enhancing conductivity. The continuity of the path, improve interface compatibility, improve curing efficiency and enhance crosslinking density. These mechanisms work together to make EMI excellent in improving the conductivity of epoxy resins.
Future research direction
Although this study has achieved certain results, the influence of EMI on the conductivity of epoxy resinsThere are still many issues worth discussing in depth. Future research can be carried out from the following aspects:
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Optimize the amount of EMI and curing conditions: Although the experimental results show that the amount of EMI is effective at 7 wt%, different application scenarios may have different additions and curing conditions for EMI and curing conditions. Requirements. Future research can further optimize the amount of EMI addition and curing conditions to achieve excellent conductivity and mechanical properties.
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Explore the application of new conductive fillers: Currently commonly used conductive fillers such as carbon black, graphene and silver powder have their own advantages and disadvantages in terms of conductive properties. Future research can try to introduce more new conductive fillers, such as carbon nanotubes, metal oxides, etc., to further improve the conductive properties of epoxy resins. At the same time, the synergistic effects between different conductive fillers can also be studied to develop more advantageous conductive composite materials.
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Develop multifunctional conductive epoxy resins: In addition to conductive properties, the performance of epoxy resins in other aspects is also worthy of attention. Future research can combine the modification of EMI to develop conductive epoxy resins with multiple functions, such as composite materials that have both electrical conductivity, thermal conductivity, electromagnetic shielding and other functions. This will provide more possibilities for the application of epoxy resins in the high-tech field.
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In-depth study of the mechanism of action of EMI: Although we have revealed the main mechanism of the influence of EMI on the conductivity of epoxy resins, its specific mechanism of action still needs further study. Future work can use advanced characterization technologies such as X-ray diffraction (XRD), infrared spectroscopy (FTIR), etc. to deeply explore the interaction between EMI with epoxy resin and conductive filler during curing, revealing its conductivity. Improved micro mechanism.
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Expanded application scope: At present, EMI modified conductive epoxy resin is mainly used in electronic packaging, electromagnetic shielding and other fields. Future research can further expand its application scope, such as emerging fields such as smart materials, flexible electronics, and energy storage. Through cooperation with different industries, we will promote the practical application of EMI-modified conductive epoxy resins in more fields.
In short, as a highly efficient curing agent, EMI can not only significantly improve the conductive properties of epoxy resin, but also enhance its mechanical properties and thermal stability. Future research will further optimize its application conditions and develop more high-performance conductive composite materials to provide strong support for the wide application of epoxy resins in the field of high-tech.
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